Download Chemical Mechanical Polishing in Silicon Processing by R.K. Willardson and Eicke R. Weber (Eds.) PDF

By R.K. Willardson and Eicke R. Weber (Eds.)

For the reason that its inception in 1966, the sequence of numbered volumes referred to as Semiconductors and Semimetals has uncommon itself throughout the cautious choice of famous authors, editors, and participants. The Willardson and Beer sequence, because it is well known, has succeeded in generating a variety of landmark volumes and chapters. not just did lots of those volumes make an influence on the time in their e-book, yet they remain well-cited years after their unique liberate. lately, Professor Eicke R. Weber of the collage of California at Berkeley joined as a co-editor of the sequence. Professor Weber, a well known specialist within the box of semiconductor fabrics, will additional give a contribution to carrying on with the sequence' culture of publishing well timed, hugely correct, and long-impacting volumes. the various contemporary volumes, akin to Hydrogen in Semiconductors, Imperfections in III/V fabrics, Epitaxial Microstructures, High-Speed Heterostructure units, Oxygen in Silicon, and others promise that this custom might be maintained or even expanded.Reflecting the actually interdisciplinary nature of the sphere that the sequence covers, the volumes in Semiconductors and Semimetals were and may remain of serious curiosity to physicists, chemists, fabrics scientists, and gadget engineers in glossy undefined.

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2, 1998. 16. J. R. Breivogel, S. F. Louke, M. R. Oliver, L. D. Yau, C. E. S. Patent #5,554,064, issued Sept. 10, 1996. 17. A. R. Baker, “The Origin of the Edge Effect in Chemical Mechanical Planarization,” presented at the ECS Fall 1996 meeting, San Antonio, TX. 18. D. Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin, T. Cale, “Von Mises stress in chemical-mechanical polishing processes,” J . Electrochem. , Vol. 144, No. 3, pp. 1121-1127, March 1997. 19. C. Srinivasa-Murthy, D. Wang, S . P. Beaudoin, T.

B) Schematic representation of the region on a wafer that a polish block may contact. it is absent. In one invention, the pressure applied to the retaining ring is adjusted separately from that of the carrier [33]. Another carrier design uses concentric pistons with independent pressure control [34]. A subsequent invention involves the use of a wear ring with independent pressure control to minimize the edge effect, and the use of a lip seal to allow limited vertical wafer motion independently of the retaining ring [35].

CMP Equipment Integration CMP tools have become much more sophisticated than first-generation CMP tools. ), but left much room for improvement. The need for a reliable source of slurry during C M P stimulated the growth of a whole industry of bulk chemical distribution (BCD) systems. An extended discussion of BCD systems is beyond the scope of this work, but a few words are in order. Slurry distribution systems vary in sophistication from the simple laboratory system consisting of little more than a barrel of slurry and a pump to sophisticated delivery systems designed to supply slurry to tens of CMP tools in a high-volume production environment [56].

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