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61] H. , A new packaging technology for Gaas MMICs modules. IEEE GaAs IC Symp. Dig. 307-310, 1989. [62] B. Berson, F. Rosenbaum, and R. A. Sparks, MMIC packaging. In Monolithic Microwave Integrated Circuits (R. ). Artech House, Norwood, MA 1989. [63] R. R. Tummala and E. J. ), Microelectronic Packaging Handbook. Van Nostrand Reinhold, New York, 1989. [64] S. , Low-cost package technology for advanced MMIC applications. IEEE MTT-S Int. Microwave Symp. Dig. 625-628, 1990. [65] S. R. Smith and M.

Artech House, Norwood, MA 1989. [63] R. R. Tummala and E. J. ), Microelectronic Packaging Handbook. Van Nostrand Reinhold, New York, 1989. [64] S. , Low-cost package technology for advanced MMIC applications. IEEE MTT-S Int. Microwave Symp. Dig. 625-628, 1990. [65] S. R. Smith and M. T. Murphy, Electrical characterization of packages for use with GaAs MMIC amplifiers. IEEE MTT-S Int. Microwave Symp. Dig. 131-134, 1993. 1. MMIC Technology Overview 27 [66] D. , Microwave and millimeter-wave packaging and interconnection methods for single and multiple chip modules.

Wacker, GaAs integrated microwave circuits. IEEE Trans. Microwave Theory Tech. MTT-16, 451-454, July 1968. [3] R. S. Pengelly and J. S. Turner, Monolithic broadband GaAs FET amplifiers. Electron. Lett. 12, 251-252, May 13, 1976. [4] J. V. Dilorenzo and D. D. ), GaAs FET Principles and Technology. Artech House, Norwood, MA, 1982. [5] R. S. Pengally, Microwave Field-Effect Transistors--Theory, Design and Applications. Wiley, New York, 1982. [6] R. Soares, J. Graffeuil, and J. ), Applications of GaAs MESFETs.

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