By Lieng-Huang Lee (auth.), Lieng-Huang Lee (eds.)
Since the 1st symposium on contemporary Advances in Adhesion, held September, 1971 in Washington, D. C. , this department of the yankee Chemical Society has constantly subsidized a number of symposia on adhesion and adhesives. The chemists have steadily learned the significance of adhesion in a number of fields of technology and know-how. in the course of those years, the technology of adhesion has gradually grown in addition to growth in floor technology and fracture mechanics. in addition, new adhesives were invented and utilized in genuine buildings, for instance, structural and aerospace adhesives. according to socio-economic calls for, new varieties of adhesives were brought to wrestle the issues of toxins and to advertise energy-conservation. The advancements of hot-melt adhesives, waterborne adhesives, and radiation-curable adhesives are brilliant examples of successes in fixing many of the difficulties. As chemists, our hatural hope is to appreciate how these new adhesives and new varieties of adhesives are made. therefore, we're attracted to studying in regards to the chemistry of adhesives in order that we could create new generations of fabrics to fulfill destiny wishes. It was once in response to this universal curiosity that w~ set forth to org'anize this Symposium on fresh advancements in Adhesive Chemistry. It was once held from March 21 via 23, 1983 within the Westin inn, Seattle, Washington. The Symposium used to be rather well attended. in fact, for the 1st classes, we needed to movement from the smaller Mt. St.
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Extra info for Adhesive Chemistry: Developments and Trends
X. AEROSPACE STRUCTURAL ADHESIVES A special study on aerospace structural adhesives was conducted in 1976 by the National Materials Advisory Board of the National Research Council. The final report was published as one of the series in Treatise on Adhesion and Adhesives (108). , vinyl-phenolics, nitri1ephen olics , epoxy-phenolics, nylon-epoxies, and elastomer-epoxies. Po1yimide and po1ybenzamidazo1e adhesives were barely mentioned. Most of the high-temperature adhesives discussed in one of the preceding sections were either not invented or not developed at that time.
R. L. Levy and D. P. Ames, "Monitoring Epoxy Cure Kinetics with a Viscosity-Dependent Fluorescence Probe," in Ref. 14. 34. J. T. Dickinson, "Fracto-Emission Adhesive Failure,n in Ref. 14. Accompanying 35. Y. Nakano, nPhotosensitive Adhesives and Sealants," Adhesives Age, 16, No. 12, 28 (1973). 36. K. C. Stueben, "Radiation Curing of PressureSensitive Adhesives: It. 5, 16 (1977). -H. LEE 54 37. K. C. Stueben, "Ultraviolet Cured Pressure Sensitive Adhesives," in Ref. 14. 38. V. D. McGinness, "Polymer and Formulation Design Characteristics for Developing Adhesive Bonding Radiation-Curable Systems," in Ref.
Lee, Editor, Plenum, New York (1984). 15. M. C. H. Lee, "An Analytical Method for Determining the Surface Energy of Solid Polymers," in Ref. 14. 16. H. P. Schreiber, C. Richard, and M. R. ~ Surf~£es, Vol. 1, 739, Plenum, New York (1981). 17. R. K. Samal, H. Iwata, and Y. Ikada, "Introduction of Reactive Groups onto Polymer Surfaces," in p. 801 of Ref. 16. 18. T. S. Keller, A. S. Hoffman, B. D. Ratner, and B. J. McElroy, "Chemical Modification of Kevlar R Surfaces for Improved Adhesion to Epoxy Resin Matrices: I.